| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a chip-like electronic component, by which yield can be improved.SOLUTION: A manufacturing method for a chip-like electronic component comprises: a step in which strip-like insulation substrates 16 are held in a stack on a strip stacking jig, each strip-like insulation substrate having a register formed by printing and baking resistive paste and also having a protective film 15 formed by printing and baking resin; and a step in which the exposed end face portion is sputtered to form an end face electrode. The end face electrode is formed while a weighting member 18 is placed on the upper face of the strip-like insulation substrate 16 located on the uppermost surface of the strip stacking jig, the weighting member 18 being almost axial symmetrical with respect to the widthways center line 16a of the strip-like insulation substrates 16, having a width greater than the strip-like insulation substrates 16 as viewed above, and being equal to or greater than the length of the strip-like insulation substrates as viewed above.</p> |
