发明名称 CUTTING CHIP PROCESSING UNIT
摘要 <p>PROBLEM TO BE SOLVED: To provide a cutting chip processing unit for surely removing cutting chips on a carrying device, even if a product of a state of warping the width direction by a roll molding machine and the cutting chips, superposably exists on the carrying device.SOLUTION: The cutting chip processing unit removes cutting chips 21b to the outside of a carrying device 13 from above the carrying device 13 for carrying the cutting chips 21b of cutting a plate material 20 in the first direction, and comprises a first discharge mechanism 2 having a rotary surface in the second direction different from the first direction and having a revolvably driven hooking projection part 2d, and the first discharge mechanism 2 removes the cutting chips 21b to the outside of the carrying device 13 by contacting the hooking projection part 2d with the cutting chips 21b by revolvably driving the hooking projection part 2d.</p>
申请公布号 JP2015093371(A) 申请公布日期 2015.05.18
申请号 JP20130236237 申请日期 2013.11.14
申请人 JFE METAL PRODUCTS & ENGINEERING INC 发明人 NAGAI SHINJI;SUMISADA KENJI;YOSHIMURA KAZUYA
分类号 B23D33/00;B26D7/18;B30B13/00 主分类号 B23D33/00
代理机构 代理人
主权项
地址