发明名称 |
CHIP ELECTRONIC COMPONENT |
摘要 |
A chip electronic component is provided to make it possible to absorb an external impact as stress concentration does not occur and to improve drop reliability, by comprising: a ceramic main frame; an internal electrode formed inside the ceramic main frame and exposed to the surface of the ceramic main frame; and an external electrode formed on the outside of the ceramic main frame and electrically connected to the internal electrode. |
申请公布号 |
KR20150053445(A) |
申请公布日期 |
2015.05.18 |
申请号 |
KR20130135391 |
申请日期 |
2013.11.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SHIN, SUNG SIK;LEE, MIN AH |
分类号 |
H01F17/00;H01F27/28 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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