软且可修整化学机械硏磨垫堆叠体;SOFT AND CONDITIONABLE CHEMICAL MECHANICAL POLISHING PAD STACK

摘要

所提供之化学机械研磨垫堆叠体系含有：研磨层；刚性层；以及，将该研磨层结合至该刚性层之热熔性黏着剂；其中，该研磨层系包含下列成分之反应产物，该成分包括：多官能异氰酸酯；以及，固化剂包；其中，该固化剂包系含有胺起始之多元醇固化剂及高分子量多元醇固化剂；其中，该研磨层系显现大于0.6g/cm 3 之密度；5至40之肖氏D(Shore D)硬度；100至450%之断裂伸长率；以及，25至150μm/hr之切割速率；以及，其中，该研磨层系具有适用于研磨基板之研磨表面。; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm 3 ; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.