LATCH AND THE SOCKET FOR SEMICONDUCTOR PACKAGE COMPRISING THE SAME

摘要

The present invention provides a latch for a socket for mounting a semiconductor package, wherein a roller is installed on the end pressurizing the upper surface of the semiconductor package. According to such configurations, the present invention has excellent wear resistance even after long-term repetitive tests, and prevents cracks and a contact failure caused by a lack of pressure by pressurizing both sides of the package only to the vertically downward with even pressure. Therefore, the present invention makes it possible to extend the lifetime of the socket comprising the latch and perform reliable tests.