SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

Suggested are a semiconductor device and a method for manufacturing the same. The semiconductor device includes a through electrode which practically penetrates a substrate and has an end which protrudes from a surface, a passivation layer which covers the surface of the substrate and has a plug hole which exposes the surface of the end of the through electrode to a bottom part, and a barrier plug which is filled in the plug hole.