摘要 |
Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG. |