发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG.
申请公布号 HK1198562(A1) 申请公布日期 2015.05.15
申请号 HK20140112039 申请日期 2014.11.28
申请人 发明人 NOBUHIRO KINOSHITA
分类号 H01L 主分类号 H01L
代理机构 代理人
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