发明名称 |
POLISHING SLURRY ADDOTIVE COMPOSITION AND SLURRY COMPOSITION INCLUDING THE POLISHING SLURRY ADDOTIVE COMPOSITION |
摘要 |
The present invention relates to an additive for polishing slurry and a slurry composition including the same, which can decrease an amount of dishing generated when being used for polishing or leveling anti-oxidant films and, more specifically, an additive for polishing slurry, comprising a polyacrylic acid based immobilizing agent and a glycol based composite forming agent, and a slurry composition, comprising the additive for polishing slurry with a polyacrylic acid based immobilizing agent, a glycol based composite forming agent and a polishing solution having a polishing particle and a dispersing agent, thereby decreasing dishing situations and improving the performance of super-fine devices. |
申请公布号 |
KR20150053048(A) |
申请公布日期 |
2015.05.15 |
申请号 |
KR20130134737 |
申请日期 |
2013.11.07 |
申请人 |
K.C.TECH CO., LTD.;IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
发明人 |
PAIK, UN GYU;SEO, JI HOON;LEE, JAE HAK;HWANG, JUN HA;HWANG, JIN MYUNG;GWON, CHANG GIL |
分类号 |
C09K3/14;H01L21/304 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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