发明名称 POLISHING SLURRY ADDOTIVE COMPOSITION AND SLURRY COMPOSITION INCLUDING THE POLISHING SLURRY ADDOTIVE COMPOSITION
摘要 The present invention relates to an additive for polishing slurry and a slurry composition including the same, which can decrease an amount of dishing generated when being used for polishing or leveling anti-oxidant films and, more specifically, an additive for polishing slurry, comprising a polyacrylic acid based immobilizing agent and a glycol based composite forming agent, and a slurry composition, comprising the additive for polishing slurry with a polyacrylic acid based immobilizing agent, a glycol based composite forming agent and a polishing solution having a polishing particle and a dispersing agent, thereby decreasing dishing situations and improving the performance of super-fine devices.
申请公布号 KR20150053048(A) 申请公布日期 2015.05.15
申请号 KR20130134737 申请日期 2013.11.07
申请人 K.C.TECH CO., LTD.;IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) 发明人 PAIK, UN GYU;SEO, JI HOON;LEE, JAE HAK;HWANG, JUN HA;HWANG, JIN MYUNG;GWON, CHANG GIL
分类号 C09K3/14;H01L21/304 主分类号 C09K3/14
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