PROCEDE D'ENCAPSULATION D'UN DISPOSITIF MICROELECTRONIQUE

摘要

The method involves realizing a microelectronic device (100) on a substrate (102). Another substrate (106) is bonded to the former substrate. A cavity (104) to be hermetically sealed against air is formed. The microelectronic device is encapsulated in the cavity hermetically sealed against air, where a cap of the cavity comprises a wall (109) permeable to noble gas. The wall is formed by part of the latter substrate. The noble gas is injected into the cavity through the wall. The cavity is hermetically sealed against air and the noble gas injected into the cavity.