CERAMIC WIRING BOARD, CERAMIC GREEN SHEET FOR CERAMIC WIRING BOARD, AND GLASS CERAMIC POWDER FOR CERAMIC WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a ceramic wiring board high in mechanical strength, which can be baked at a low temperature, and of which the thermal expansion coefficient can be controlled to become low.SOLUTION: A ceramic wiring board 1 comprises a ceramic substrate 10 and an internal conductor 20. The internal conductor 20 is provided inside the ceramic substrate 10 as a form of wiring. The ceramic substrate 10 includes glass, a first ceramic filler and a second ceramic filler. The first ceramic filler is lower than the second ceramic filler in thermal expansion coefficient in a temperature range of -40 to +125°C. The second ceramic filler is higher than the first ceramic filler in three-point-bending strength.