SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving reliability when heat stress is applied by uniformly dispersing heat stress caused by a difference between thermal expansion coefficients of the semiconductor device and a mounting board in the semiconductor device, and a method for manufacturing the same.SOLUTION: A semiconductor device 20 comprises a semiconductor element 21; a plating part 15 for the semiconductor element, on which the semiconductor element 21 is placed; a plurality of plating parts 16 for leads arranged around the plating part 15 for the semiconductor element on the same plane as that of the plating part 15 for the semiconductor element; and bonding wires 22 electrically connecting the plating parts 16 for the leads to the semiconductor element 21. The plating part 15 for the semiconductor element, the plating parts 16 for the leads, the semiconductor element 21 and the bonding wires 22 are sealed with a sealing resin part 23. Each of the plating parts 16 for the leads is arranged on a circumference Caround the plating part 15 for the semiconductor element in plan view.