COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD AND METHOD OF USE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminate capable of coping with higher frequency application accompanying downsizing and advanced performance of an electronic apparatus, and to provide a printed circuit board and a method of use thereof.SOLUTION: A copper-clad laminate includes: a polyimide insulation layer; and copper foil on at least one face of the polyimide insulation layer. The polyimide insulation layer has a linear thermal expansion coefficient of 0 ppm/K or more and 30 ppm/K or less, and an Evalue less than 0.009 that is an index to represent dielectric characteristics and is calculated based on formula (i): E=√ε×Tanδ, whereεdenotes a dielectric constant at 3 GHz in a cavity resonance perturbation method, and Tanδdenotes a dielectric loss tangent at 3 GHz in a cavity resonance perturbation method. The copper foil has a root mean square surface roughness (Rq) of 0.05μm or more and less than 0.5μm on a surface contacting the polyimide insulation layer.