Methods of Removing Particles from Over Semiconductor Substrates

摘要

Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

主权项

1. A method of removing particles from over a surface of a semiconductor substrate, the method comprising:
flowing a liquid across the surface and the particles, the liquid having thickness over the substrate, a first region of the thickness being near the substrate, a second region of the thickness being further from the substrate than the first region; while the liquid is flowing, imparting an electric field across at least a region of the surface, the substrate having a primary horizontal surface, and wherein at least a majority of the electric field is oriented perpendicular to said primary horizontal surface; and wherein the electric field causes forces on the particles which enhance transport of the particles from the first region to the second region.