| 摘要 |
<p>The present invention addresses the problem of providing a polishing composition that makes it possible to polish in a uniform manner and at a high polishing speed while sufficiently suppressing dishing when polishing a printed wiring board, and of providing a method for manufacturing a printed wiring board. This polishing composition for polishing a printed wiring board provided with an insulating layer and a copper-containing electroconductive layer contains abrasive grains, a copper complexing agent, alkylbenzenesulfonate triethanolamine, and water. The content of alkylbenzenesulfonate triethanolamine may be 0.3-5 mass%. The pH may be between 9.0 and 10.5, inclusive. The abrasive grains may be colloidal silica. A defoaming agent may be additionally contained.</p> |
