| 发明名称 |
FAST CURE EPOXY RESINS AND PREPREGS OBTAINED THEREFROM |
| 摘要 |
Fast cure resin system comprise semisolid epoxy resins and finely divided curatives of particle size less than 25 microns. The resins are dry to the touch, can be readily combined with fibrous reinforcement to provide prepregs which can be rapidly cured in a short moulding cycle. |
| 申请公布号 |
US2015132566(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201314400388 |
申请日期 |
2013.05.15 |
| 申请人 |
Hexcel Composites Limited ;Hexcel Holding GMBH |
发明人 |
Ganglberger Thorsten;Wenidoppler Birgit;Englisch Herwig;Whiter Mark |
| 分类号 |
C08G59/40;C08L9/02;C08L87/00;C08L63/00 |
主分类号 |
C08G59/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition comprising a semisolid epoxy resin containing a curative dispersed therein, said curative having a particle size such that at least 90% of the particles have a size below 25 μm at ambient temperature of 21° C. |
| 地址 |
Cambridge GB |
