SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and a method for manufacturing a semiconductor package that comprises a unit substrate, for example to which a semiconductor chip is attached, embedded in a base substrate on which a semiconductor device may be mounted. The base substrate may, for example, comprise vias between top and bottom surfaces thereof and/or vias between the top surface of the base substrate and a top surface of the unit substrate embedded within the base substrate.

主权项

1. A semiconductor package comprising:
a unit substrate comprising a unit substrate top surface, a unit substrate bottom surface, and unit substrate side surfaces connecting the unit substrate top surface and the unit substrate bottom surface; a semiconductor die comprising a die top surface, a die bottom surface, and die side surfaces connecting the die top surface and the die bottom surface, wherein the die bottom surface is coupled to the unit substrate top surface; a base substrate comprising a base substrate top surface, a base substrate bottom surface, and base substrate side surfaces connecting the base substrate top surface and the base substrate bottom surface; and a semiconductor device coupled to the base substrate top surface, wherein the unit substrate and the semiconductor die are embedded in the base substrate, such that at least the top and side surfaces of the unit substrate and at least the side and top surfaces of the semiconductor die are contacted and surrounded by the base substrate.