| 摘要 |
Provided are an apparatus and a method for treating substrate. An apparatus for treating substrate according to the present invention incudes a chamber which has an opening which is open downwards, a door which opens/closes the opening, a laser irradiation device which faces the opening outside the chamber, a cover glass which is interposed between the opening and the laser irradiation device, and a first electrode plate and a second electrode plate which are adjacent to the outside of the opening and face each other. |
