| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor device includes a carrier and a metallic structure including a metallic member, a pad and a via portion; wherein the metallic member is disposed inside the carrier, the pad is configured for receiving a solder bump and is disposed on a surface of the carrier, the via portion is configured for electrically connecting the metallic member and the pad, and the via portion is disposed proximal to an end of the pad. Further, a method of manufacturing a semiconductor device includes providing a carrier, removing a portion of the carrier for forming a via extending a surface of the carrier to an interior of the carrier, filling the via by a conductive material, and disposing the conductive material on the surface of the carrier, wherein the via is disposed proximal to an end portion of the conductive material. |
| 申请公布号 |
US2015130049(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201314077019 |
申请日期 |
2013.11.11 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Ltd. |
发明人 |
CHEN YING-JU;CHEN HSIEN-WEI |
| 分类号 |
H01L23/498;H01L23/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a carrier; and a metallic structure including a metallic member, a pad and a via portion; wherein the metallic member is disposed inside the carrier, the pad is configured for receiving a solder bump and is disposed on a surface of the carrier, the via portion is configured for electrically connecting the metallic member and the pad, and the via portion is disposed proximal to an end of the pad. |
| 地址 |
Hsinchu TW |
