| 主权项 |
1. A semiconductor module with radiation fins, comprising:
a semiconductor module including a metal base, wherein the metal base has an outer circumferential portion surrounding the same and a top panel portion surrounded by the outer circumferential portion, and one side of the top panel portion is disposed with a plurality of semiconductor chips through a plurality of corresponding insulating substrates and the other side of the top panel portion is disposed with radiation fins, the plurality of semiconductor chips is connected to electric wiring to electrically connect to outside of the semiconductor module, a thickness of the top panel portion is less than a thickness of the outer circumferential portion, the top panel portion between the insulating substrates has a groove, the groove has an opening narrower than a bottom portion, and the plurality of semiconductor chips is sealed by resin together with the groove. |
