APPARATUS FOR BARRIER INTERFACE PREPARATION OF COPPER INTERCONNECT

摘要

An integrated system for processing a substrate to improve electromigration performance of a copper interconnect, including: a lab-ambient transfer chamber capable of transferring the substrate from a substrate cassette coupled to the lab-ambient transfer chamber into the integrated system; a vacuum transfer chamber operated under vacuum at a pressure less than 1 Torr; a vacuum process module for depositing a metallic barrier layer, wherein the vacuum process module for depositing the metallic barrier layer is coupled to the vacuum transfer chamber, and is operated under vacuum at a pressure less than 1 Torr; a controlled-ambient transfer chamber filled with an inert gas selected from a group of inert gases; and, a deposition process module used to deposit a functionalization layer on the surface of the metallic barrier layer, wherein the deposition process module used to deposit the functionalization layer is coupled to the controlled-ambient transfer chamber.

主权项

1. An integrated system for processing a substrate in a controlled environment to enable deposition of a functionalization layer over a metallic barrier layer of a copper interconnect to improve electromigration performance of the copper interconnect, comprising:
a lab-ambient transfer chamber capable of transferring the substrate from a substrate cassette coupled to the lab-ambient transfer chamber into the integrated system; a vacuum transfer chamber operated under vacuum at a pressure less than 1 Torr; a vacuum process module for depositing the metallic barrier layer, wherein the vacuum process module for depositing the metallic barrier layer is coupled to the vacuum transfer chamber, and is operated under vacuum at a pressure less than 1 Torr; a controlled-ambient transfer chamber filled with an inert gas selected from a group of inert gases; and a deposition process module used to deposit the functionalization layer on the surface of the metallic barrier layer, wherein the deposition process module used to deposit the functionalization layer is coupled to the controlled-ambient transfer chamber.