发明名称 |
COPPER PARTICLE DISPERSION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME |
摘要 |
A copper particle dispersion of fine copper particles having an average size of 1-100 nm, the copper particles being coated by an azole compound such as benzotriazole or the like, and coarse copper particles having an average size of 0.3-20 μm dispersed a dispersion medium such as ethylene glycol or the like so that the total amount of fine copper particles and coarse copper particles is 50-90 mass% and the mass ratio is 1:9-5:5 is applied to a substrate by screen printing or flexo printing, prebaked by vacuum drying, then baked by application of light by applying light of a wavelength of 200-800 nm at a pulse period of 100-3000 μs and a pulse voltage of 1600-3600 V. |
申请公布号 |
WO2015068826(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
WO2014JP79657 |
申请日期 |
2014.10.31 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
FUJITA, HIDEFUMI;KANEDA, SHUJI;ITOH, DAISUKE |
分类号 |
C09D5/24;B22F1/02;B22F9/24;C09D7/12;H01B1/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 |
主分类号 |
C09D5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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