| 摘要 |
Size reduction of a semiconductor module (1) is made possible by disposing outside of a mold section a common connecting section (26) to be connected to terminals of circuits, said terminals being at a same potential. Since the common connecting section (26) is a part of a lead frame (25) disposed inside of the mold section in conventional semiconductor modules, a size of the mold section is reduced, and a quantity of a molding resin and a material cost are reduced compared with the conventional cases. |
