| 摘要 |
Provided is a printed wiring board, particularly a printed wiring board having a curable composition whereby good adhesion to a flexible substrate or the like and high hardness are obtained at the same time, a resist coating film of the curable composition, and a resist pattern of the resist coating film. A curable composition including (A) a photobase generator, (B-1) a (meth)acrylate compound having an epoxy group or (B-2) a (meth)acrylate compound having a carboxyl group, (C) a photopolymerization initiator, and (D-1) a thermosetting component (excluding the (meth)acrylate compound (B-1) having an epoxy group) or (D-2) a thermosetting component (excluding the (meth)acrylate compound (B-2) having a carboxyl group). |
