MOLD RELEASE FILM AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

摘要

Provided are: a mold release film, which has excellent mold release characteristics and suppresses contamination of a resin-sealed section and a molding die due to the mold release film at the time of sealing a semiconductor element using a curable resin, and furthermore, which is capable of forming the resin-sealed section having excellent adhesiveness to an ink layer; and a semiconductor package manufacturing method using the mold release film. This mold release film is to be disposed on a cavity surface of a molding die in a semiconductor package manufacturing method, wherein a semiconductor element is disposed in the molding die, and a resin-sealed section is formed by sealing the semiconductor element using a curable resin. The mold release film is characterized in that: the mold release film has a first surface in contact with the curable resin at the time of forming the resin-sealed section, and a second surface in contact with the cavity surface; at least the first surface is formed of a fluorine resin; and in a predetermined test method, a value of F/Al is 0.2-4 or a value of F/(C+F+O) is 0.1-0.3.