| 发明名称 |
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step. |
| 申请公布号 |
US2015131235(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414260994 |
申请日期 |
2014.04.24 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOO Do Jae;JO Eun Jung;LIM Jae Hyun |
| 分类号 |
H05K5/06;H05K1/18 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component module, comprising:
a substrate; at least one electronic component mounted on the substrate; a mold part sealing the electronic component; and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part, wherein the connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step. |
| 地址 |
SUWON-SI KR |
