发明名称 CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE
摘要 It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
申请公布号 US2015131229(A1) 申请公布日期 2015.05.14
申请号 US201314401282 申请日期 2013.05.10
申请人 NEC Corporation 发明人 Matsunaga Arihiro;Yoshikawa Minoru;Sakamoto Hitoshi;Shoujiguchi Akira;Chiba Masaki;Inaba Kenichi
分类号 H05K7/20;B23P15/26 主分类号 H05K7/20
代理机构 代理人
主权项 1. A connecting structure of a cooling device, comprising: a connecting board with an opening; a pressing plate of thin plate elastically deformable; a first fixing unit for fixing the pressing plate to the connecting board with the pressing plate disposed covering a heat receiving unit composing the cooling device; and a second fixing unit for fixing the connecting board to a substrate with the heat receiving unit abutting against a heating element mounted on the substrate and disposed in the opening.
地址 Tokyo JP