| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device including a semiconductor element; a pad electrode that is formed on the semiconductor element; an alignment mark that is formed on the semiconductor element; a connection electrode that is formed on the pad electrode; and an underfill resin that is formed to cover the connection electrode. The height of the alignment mark from the semiconductor element is greater than that of the connection electrode. |
| 申请公布号 |
US2015130056(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201514600371 |
申请日期 |
2015.01.20 |
| 申请人 |
Sony Corporation |
发明人 |
Wakiyama Satoru |
| 分类号 |
H01L25/065;H01L23/00;H01L23/31;H01L23/544 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor element; a passivation layer on the semiconductor element; a pad electrode on the semiconductor element; and an alignment mark on the semiconductor element, wherein,
a part of the passivation layer is the alignment mark. |
| 地址 |
Tokyo JP |
