| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
Provided are semiconductor packages and methods of fabricating the same. The method may include, stacking a lower semiconductor chip on a lower package substrate, forming a lower molding layer on the lower package substrate, forming a connecting through-hole and an element through-hole by performing a laser drilling process on the lower molding layer, and stacking an upper package substrate having a bottom surface to which a passive element is bonded on the lower package substrate to insert the passive element into the element through-hole. |
| 申请公布号 |
US2015130041(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414534607 |
申请日期 |
2014.11.06 |
| 申请人 |
SEO Jangmee;LEE Heeseok;LEE Jong-won |
发明人 |
SEO Jangmee;LEE Heeseok;LEE Jong-won |
| 分类号 |
H01L23/64;H01L25/07;H01L23/538;H01L25/00 |
主分类号 |
H01L23/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a semiconductor package, the method comprising:
stacking a lower semiconductor chip on a lower package substrate; forming a lower molding layer on the lower package substrate; forming a connecting through-hole and an element through-hole by performing a laser drilling process on the lower molding layer; and stacking an upper package substrate having a bottom surface to which a passive element is bonded on the lower package substrate to insert the passive element into the element through-hole. |
| 地址 |
Seoul KR |
