| 摘要 |
In a PCB, a pad is formed on the upper side of a multi-layered PCB where a conductive layer and an insulating layer are stacked. A via is formed in the center of the pad. The via penetrates a multi-layered substrate for the electrical connection of the substrate. A plating layer is formed on the inner wall of the via to secure the conductivity of the via. A filling material is filled in the via. The filling material is a solder ball. The prevent invention relates to an in-pad integrated PCB. The conductive ball which is larger than the via is directly located on the upper part of the via. A heating and pressing process is performed on the ball. A second heating is performed to insert the ball into the via. The efficiency of space arrangement according to the component mounting on the PCB can be improved by soldering while the via of the PCB is filled with metal such as a conductive ball or solder cream to maintain electric conductivity. Material costs can be greatly reduced by reducing the size of the PCB in mounting the same component. Thereby, manufacturing time can be reduced and the manufacturing costs can be saved. |
