SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF

摘要

The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.

主权项

1. A semiconductor package, comprising:
a substrate; a passivation layer over the substrate; a post-passivation interconnect (PPI) having a top surface, positioning over the passivation layer; and a conductive structure electrically connected to the PPI, wherein the top surface of the PPI comprises:
a first region receiving the conductive structure; anda second region surrounding the first region,wherein the second region comprises metal derivative transformed from materials made of the first region.