发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator. |
申请公布号 |
US2015129293(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
US201414537998 |
申请日期 |
2014.11.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO Suk Hyeon;NAM Hyo Seung;LEE Yong Sam;AHN Seok Hwan |
分类号 |
H05K1/02;H05K3/42;H05K3/00;H05K3/46;H05K1/11;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A printed circuit board comprising:
a core made of a glass material; an insulator surrounding the entire outer peripheral surface, including lateral side surfaces, of the core; a first internal circuit layer formed on a first side of the insulator; and a via passing through the core and the insulator and electrically connecting the first internal circuit layer to another internal circuit layer on a second side of the insulator. |
地址 |
Suwon-Si KR |