发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
申请公布号 US2015129293(A1) 申请公布日期 2015.05.14
申请号 US201414537998 申请日期 2014.11.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO Suk Hyeon;NAM Hyo Seung;LEE Yong Sam;AHN Seok Hwan
分类号 H05K1/02;H05K3/42;H05K3/00;H05K3/46;H05K1/11;H05K1/03 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed circuit board comprising: a core made of a glass material; an insulator surrounding the entire outer peripheral surface, including lateral side surfaces, of the core; a first internal circuit layer formed on a first side of the insulator; and a via passing through the core and the insulator and electrically connecting the first internal circuit layer to another internal circuit layer on a second side of the insulator.
地址 Suwon-Si KR