| 发明名称 |
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT |
| 摘要 |
Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board. |
| 申请公布号 |
US2015128411(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414528364 |
申请日期 |
2014.10.30 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
WATANABE Hideaki;IMAFUKU Shigeki;KOYAMA Toshiyuki |
| 分类号 |
H05K13/04;H05K3/30 |
主分类号 |
H05K13/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for mounting an electronic component having a plurality of board insert type leads on a board, the apparatus comprising:
a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component; and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board. |
| 地址 |
Osaka JP |
