发明名称 RESIN SEALING METHOD AND RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing method and a resin sealing device capable of transporting a work and a planar support member and a mold resin efficiently to a metal mold, and performing resin molding in accordance with a variety of moldings.SOLUTION: A planar support member 50 and a mold resin 24 are supplied into a cavity recess 4 by transporting the planar support member 50, to be superposed on the cavity bottom of the cavity recess 4, to a metal mold 1 while mounting a mold resin 24, and passing the planar support member 50 to the cavity bottom while aligning.
申请公布号 JP2015092586(A) 申请公布日期 2015.05.14
申请号 JP20140246923 申请日期 2014.12.05
申请人 APIC YAMADA CORP 发明人 TAGAMI SHUSAKU;MURAMATSU YOSHIKAZU;MAEKAWA MASANORI;NAKAZAWA HIDEAKI;FUJISAWA MASAHIKO;MIYAMOTO TAKUYA
分类号 H01L21/56;B29C43/18;B29C43/34;B29C43/36 主分类号 H01L21/56
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