SINGLE INPUT/OUTPUT CELL WITH MULTIPLE BOND PADS AND/OR TRANSMITTERS

摘要

A storage module may include a controller configured to communicate with a memory having a plurality of memory dies. The controller may include a plurality of bond pads, where each bond pad is configured to communicate a same type of memory signal, and where each bond pad is electrically connected to at least one but less than all of the plurality of memory dies. A core of the controller may identify a memory die that it wants to communicate a memory signal and an associated bond pad with which to communicate the memory signal.

主权项

1. An electronic device comprising:
a first circuit comprising a plurality of first circuit bond pads configured to communicate a same type of signal; and a second circuit comprising a plurality of second circuit bond pads configured to communicate the same type of signal with the plurality of first bond pads of the first circuit, wherein each of the first circuit bond pads is electrically connected to at least one and less than all of the plurality of second circuit bond pads.