| 发明名称 |
Platen Assembly, Chemical-Mechanical Polisher, and Method for Polishing Substrate |
| 摘要 |
A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad. |
| 申请公布号 |
US2015133033(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201314078999 |
申请日期 |
2013.11.13 |
| 申请人 |
Taiwan Semiconductor Manufacturing CO., LTD. |
发明人 |
Suen Shich-Chang;Chan Chin-Hsiang;Chen Liang-Guang;Lu Yung-Cheng |
| 分类号 |
B24B37/34;B24B49/12;B24B37/10;B24B49/10;B24B37/20;B24B37/005 |
主分类号 |
B24B37/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A platen assembly, comprising:
a platen body having an upper surface; a polishing pad disposed on the upper surface of the platen body; and a fountain slurry supplier at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad. |
| 地址 |
Hsinchu TW |
