SMART DEVICE FABRICATION VIA PRECISION PATTERNING

摘要

Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.

主权项

1. A method of manufacturing a semiconductor processing tool component, the method comprising:
providing a substrate of the semiconductor processing tool component; patterning the substrate to form a sensor directly on the substrate; and depositing a top layer over the sensor.