| 摘要 |
The present invention relates to a heat sink for an LED module and a fabricating method for the heat sink for an LED module, and more specifically, to a heat sink for an LED module of which the heat radiation is improved by attaching a pin closely to the lower surface and the two sides of the base part; of which the durability is improved by securely fastening pin and base with a fixating means that is formed as a single body along with the pin and base; and that can be utilized as head lamps for vehicles, and a fabricating method for the heat sink for an LED module. |
