发明名称 |
Fin Structure for a FinFET Device |
摘要 |
A fin structure for a fin field effect transistor (FinFET) device is provided. The device includes a substrate, a first semiconductor material disposed on the substrate, a shallow trench isolation (STI) region disposed over the substrate and formed on opposing sides of the first semiconductor material, and a second semiconductor material forming a first fin and a second fin disposed on the STI region, the first fin spaced apart from the second fin by a width of the first semiconductor material. The fin structure may be used to generate the FinFET device by forming a gate layer formed over the first fin, a top surface of the first semiconductor material disposed between the first and second fins, and the second fin. |
申请公布号 |
US2015132920(A1) |
申请公布日期 |
2015.05.14 |
申请号 |
US201514604401 |
申请日期 |
2015.01.23 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Vellianitis Georgios;van Dal Mark;Duriez Blandine;Oxland Richard Kenneth |
分类号 |
H01L29/66;H01L27/088;H01L21/762 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a fin field effect transistor (FinFET) device, the method comprising:
forming a first fin, the first fin having isolation regions on opposing sides; recessing the isolation regions, the recessing exposing exposed sidewalls of the first fin; forming a second fin and a third fin along the exposed sidewalls of the first fin; and recessing the first fin below an upper surface of the second fin and the third fin. |
地址 |
Hsin-Chu TW |