发明名称 Fin Structure for a FinFET Device
摘要 A fin structure for a fin field effect transistor (FinFET) device is provided. The device includes a substrate, a first semiconductor material disposed on the substrate, a shallow trench isolation (STI) region disposed over the substrate and formed on opposing sides of the first semiconductor material, and a second semiconductor material forming a first fin and a second fin disposed on the STI region, the first fin spaced apart from the second fin by a width of the first semiconductor material. The fin structure may be used to generate the FinFET device by forming a gate layer formed over the first fin, a top surface of the first semiconductor material disposed between the first and second fins, and the second fin.
申请公布号 US2015132920(A1) 申请公布日期 2015.05.14
申请号 US201514604401 申请日期 2015.01.23
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Vellianitis Georgios;van Dal Mark;Duriez Blandine;Oxland Richard Kenneth
分类号 H01L29/66;H01L27/088;H01L21/762 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of forming a fin field effect transistor (FinFET) device, the method comprising: forming a first fin, the first fin having isolation regions on opposing sides; recessing the isolation regions, the recessing exposing exposed sidewalls of the first fin; forming a second fin and a third fin along the exposed sidewalls of the first fin; and recessing the first fin below an upper surface of the second fin and the third fin.
地址 Hsin-Chu TW