| 发明名称 |
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same |
| 摘要 |
A semiconductor package includes a first semiconductor module including a plurality of semiconductor transistor chips and a first encapsulation layer disposed above the semiconductor transistor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of semiconductor driver channels and a second encapsulation layer disposed above the semiconductor driver channels. The semiconductor driver channels are configured to drive the semiconductor transistor chips. |
| 申请公布号 |
US2015130071(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201314077696 |
申请日期 |
2013.11.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Hohlfeld Olaf;Hoegerl Juergen;Kessler Angela;Hoier Magdalena |
| 分类号 |
H01L25/07;H01L23/31;H01L25/00;H01L23/522 |
主分类号 |
H01L25/07 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a first semiconductor module comprising a plurality of semiconductor transistor chips and a first encapsulation layer disposed above the semiconductor transistor chips; and a second semiconductor module disposed above the first semiconductor module, the second semiconductor module comprising a plurality of semiconductor driver channels and a second encapsulation layer disposed above the semiconductor driver channels, the semiconductor driver channels being configured to drive the semiconductor transistor chips. |
| 地址 |
Neubiberg DE |
