| 摘要 |
This invention provides a semiconductor device that has a small form factor and exhibits high reliability. Said semiconductor device is provided with a deformed-rod lead frame that has a thick section and a thin section that is thinner than said thick section, a chip mounting section where a semiconductor chip is mounted, a junction section that is connected to a connection section on the semiconductor chip via a lead wire, and a connection terminal that is connected to said junction section. The thick section of the deformed-rod lead frame is formed in the middle of said deformed-rod lead frame in a Y direction thereof and has a prescribed width in an X direction that is perpendicular to said Y direction. The thin section of the deformed-rod lead frame is formed outside the thick section on both sides thereof in the X direction. The abovementioned chip mounting section is formed in the thick section of the deformed-rod lead frame, the abovementioned junction section is formed in said thick section so as to be separate from the chip mounting section, and the abovementioned connection terminal is formed in the thin section of the deformed-rod lead frame. |
