| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide rolled copper foil both excellent in etching properties, bendability, adhesion with a resin and the transparency of a resin after copper foil is removed by etching, a copper-clad laminate board and a print circuit board.SOLUTION: Provided is a rolled copper foil including copper of 99.9% or higher by a mass ratio, and in which a plating layer is formed on one side or both the sides, provided that calculated X-ray diffraction intensity from the {112} face in the rolled face is defined as I{112} and the calculated X-ray diffraction intensity from the I{110} face is defined as I{110}, 2.5≤I{110}/I{112}≤6.0 is satisfied, along the rolling vertical direction of the rolled copper foil, skewness Rsk based on JIS B0601-2001 in the surface of the plating layer is -0.35 to 0.53, after both the sides of a polyimide resin film with a thickness of 50μm are pasted with the plating layer sides of the rolled copper foil, respectively, the rolled copper foil is removed by etching, and when a printed material is pictured with a CCD camera over the polyimide resin film, Sv defined by formula (1) reaches 3.0 or higher: Sv=(ΔB×0.1)/(t1-t2)(1).</p> |
