Cu/CERAMIC ASSEMBLY, METHOD OF PRODUCING Cu/CERAMIC ASSEMBLY, AND SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a Cu/ceramic assembly where a copper member and a ceramic member are bonded reliably, and to provide a method of producing this Cu/ceramic assembly, and a substrate for power module composed of this Cu/ceramic assembly.SOLUTION: In a Cu/ceramic assembly where a copper member composed of copper or a copper alloy, and a ceramic member 11 composed of AlN or AlOare bonded using a bonding material containing Ag and Ti, a Ti compound layer 31 composed of a Ti nitride or a Ti oxide is formed on the junction interface of the copper member and ceramic member 11, and Ag particles 35 are dispersed in this Ti compound layer 31.