发明名称 LIGHT-EMITTING DEVICE MOUNTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device mounting structure which can maintain mountability of a light-emitting device on a wiring substrate even when a light-emitting region of the light-emitting device is expanded, and in which emission light from the expanded light-emitting region can be efficiently made incident on a light guide member.SOLUTION: In a light-emitting device mounting structure in which a light-emitting device having a resin molding is mounted on a wiring substrate having a wire provided on the upper face of a base material, the wiring substrate has a recessed portion on the peripheral edge; the resin molding has an arrangement portion having an outer lead which is electrically connected to the wire arranged below, a lower face having a projection portion projecting below the arrangement portion, and a side face having an opening which has a light-emitting element mounted thereon and is provided up to the projection portion; and at least a part of the opening is stored in the recessed portion.
申请公布号 JP2015092551(A) 申请公布日期 2015.05.14
申请号 JP20140194825 申请日期 2014.09.25
申请人 NICHIA CHEM IND LTD 发明人 WAKAGI RYOSUKE
分类号 H01L33/00;H01L23/12 主分类号 H01L33/00
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