SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING SAME

摘要

A semiconductor package of a POP structure includes first and second semiconductor packages, the second directly mounted on the first and containing a plurality of semiconductor chips. Chips in the second package are electrically connected via a through-electrode and the first and second packages are connected through a connection member disposed on the top surface of the first package.

主权项

1. A semiconductor package of a package on package (POP) structure, comprising:
a substrate having a connection terminal on the upper surface thereof; a first semiconductor package including a first semiconductor chip mounted on the substrate and connected to the connection terminal, the first semiconductor package also including a molding member covering only a portion of the upper surface of the first semiconductor chip and the side surfaces thereof; a second semiconductor package including a plurality of second semiconductor chips which are stacked in a multi-layer structure, the second semiconductor chips having a second semiconductor chip through-electrode by which the second semiconductor chips are connected to each other; and a connection member disposed on a portion of the upper surface of the first semiconductor package left exposed by the molding member, wherein the second semiconductor package is mounted on the first semiconductor package and electrically connected to the first semiconductor package through the connection member.