发明名称 SEVERING BOND WIRE BY KINKING AND TWISTING
摘要 An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibits a sign of the torsional force applied thereto.
申请公布号 US2015129647(A1) 申请公布日期 2015.05.14
申请号 US201414297701 申请日期 2014.06.06
申请人 Invensas Corporation 发明人 Haba Belgacem;Co Reynaldo;Saga Cizek Rizza Lee;Zohni Wael
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A method of forming an electrically conductive lead of a component, comprising: using a bonding tool to bond a wire extending beyond a surface of a bonding tool to a metal surface; drawing the bonding tool away from the metal surface while allowing the wire to extend farther from the surface of the bonding tool; clamping the wire to limit further extension of the wire beyond the surface of the bonding tool; moving the bonding tool while the wire remains clamped such that the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool; and twisting the wire and tensioning the wire using the bonding tool such that the wire breaks at the kink to define an end, wherein the lead comprises the wire extending from the metal surface to the end.
地址 San Jose CA US