ELECTRONIC-COMPONENT PACKAGE

摘要

An electronic-component package that keeps a lead member tightly connected to a conductive pad on a substrate is structured in a rational manner. Said electronic-component package comprises the following: the aforementioned substrate, which has a conductive pad as mentioned above and supports an electronic component; the aforementioned lead member, which is electrically connected to the conductive pad; and a molded section in which the substrate and the lead member are embedded. The lead member comprises an internal conductor that has a bifurcated end and a unitary section connected to said internal conductor such that the internal conductor and the unitary section form a single unit. Part of the unitary section of the lead member and the internal conductor, which is embedded inside the abovementioned molded section, are formed so as to be curved in a convex or concave manner with respect to an imaginary plane that extends along the surface of the substrate.