GRINDING DEVICE OF SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a grinding device of a semiconductor substrate which is installed in a space-saving manner and achieves low costs.SOLUTION: The grinding device of a semiconductor substrate includes a substrate transfer part 10 having a substrate transfer device 100 for transferring a substrate W among an indexer part, a substrate grinding part, a substrate polishing part, and a substrate cleaning part. The substrate transfer device 100 includes: a hand extending in a horizontal direction H; a substrate support part which is recessed on an upper surface of the hand and may support a periphery of the substrate W; and a substrate holding part which is disposed on a lower surface of the hand and may hold the periphery of the substrate W. A portion of the substrate transfer part 10, which is located below the hand, is maintained in a wet state.