METHOD FOR REPAIRING A CIRCUIT BOARD HAVING AT LEAST ONE DEFECTIVE COMPONENT

摘要

The invention relates to a method for repairing a circuit board (1) having at least one defective component (2), which is connected mechanically and/or electrically to the circuit board (1) via at least one contact point (3) on the circuit board side, wherein the method comprises at least the following steps: removing the defective component (2) from the circuit board (1); cleaning the at least one contact point (3) on the circuit board side; applying a solder paste (4) to the at least one cleaned contact point (3) on the circuit board side by means of a solder paste plunger (5), the solder application plunger (5) firstly being at least partly set down into a reservoir (6) having solder paste (4) in a wetting step, to be wetted with the solder paste (4), and then the wetted solder application plunger (5) being set down on the at least one desired contact point (3) on the circuit board side in a transfer step, such that an application of the solder paste (4) to the at least one contact point (3) on the circuit board side is made possible; fitting the circuit board (1) with a replacement component (7) provided for the defective component (2); soldering the replacement component (7) on.