发明名称 MANUFACTURING ELECTROCHEMICAL SENSOR MODULES
摘要 Certain processes for manufacturing an electrochemical sensor module include etching a Silicon wafer to form precursor sensor bodies, disposing sensor fibers along rows of the precursor sensor bodies, securing a rigid layer over the sensor fibers, dividing the wafer, rigid layer, and sensor fibers into individual precursor sensor bodies, and joining each precursor sensor body to a component body to form sensor modules.
申请公布号 US2015128412(A1) 申请公布日期 2015.05.14
申请号 US201214118732 申请日期 2012.05.18
申请人 Say James L. 发明人 Say James L.
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项 1. A method of installing sensors in sensor modules, the method comprising: providing a first wafer and a continuous length of at least a first composite sensor fiber; removing material from the first wafer to form features of a plurality of precursor sensor bodies; disposing at least the first composite sensor fiber across the features of the precursor sensor bodies; coupling a rigid body to the first wafer; separating the coupled first wafer and rigid body into a plurality of precursor sensor bodies by cutting the first wafer, the rigid body, and the first composite sensor fiber into segments.
地址 Breckenridge CO US