发明名称 LED Module Sealing Technology
摘要 A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB
申请公布号 US2015128409(A1) 申请公布日期 2015.05.14
申请号 US201314403108 申请日期 2013.06.07
申请人 Hangzhou HPwinner Opto Corporation 发明人 Chen Kai;Huang Jianming;Lu Huali
分类号 H05K5/06;F16B37/00;H05K3/10;H02G15/013 主分类号 H05K5/06
代理机构 代理人
主权项 1. A sealing process for an LED module, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board onto the heat sink; (3) fix a lens set with at least two grooves at inner and external side into a stationary fixture of a glue machine and place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set, and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire(s) as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set; and (6) make the assembled LED module stand still so that the liquid silica gel is solidified.
地址 Hangzhou, Zhejiang CN